Lenovo Intel Xeon Gold 6140 processor 2.3 GHz 24.75 MB L3
Lenovo Intel Xeon Gold 6140 Octadeca-core (18 Core) 2.30 GHz Processor Upgrade - 24.75 MB L3 Cache - 18 MB L2 Cache - 64-bit Processing - 3.70 GHz Overclocking Speed - 14 nm - Socket 3647 - 140 W
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Specifications 47
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor model | 6140 |
| Processor base frequency | 2.3 GHz |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 18 |
| Processor socket | LGA 3647 (Socket P) |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor threads | 36 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Processor cache | 24.75 MB |
| Processor cache type | L3 |
| Thermal Design Power (TDP) | 140 W |
| Cooler included | Yes |
| Stepping | H0 |
| Processor codename | Skylake |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hepta-channel |
| ECC | Yes |
| On-board graphics card | No |
| Execute Disable Bit | Yes |
| Market segment | Server |
| Maximum number of PCI Express lanes | 48 |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S4S |
| Embedded options available | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel TSX-NI | Yes |
| Intel 64 | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Conflict-Free processor | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Optane™ Memory Ready | No |
| Intel® vPro™ Platform Eligibility | Yes |
| Tcase | 91 °C |
| Processor package size | 76.0 x 56.5 mm |
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